MPC8306SVMABCA
vs
MPC8280CVRQLDX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369
27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-516
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
33.33 MHz
66.67 MHz
External Data Bus Width
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B369
S-PBGA-B516
JESD-609 Code
e1
Length
19 mm
27 mm
Low Power Mode
YES
NO
Number of Terminals
369
516
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY
Seated Height-Max
1.61 mm
2.55 mm
Speed
133 MHz
333 MHz
Supply Voltage-Max
1.05 V
1.6 V
Supply Voltage-Min
0.95 V
1.45 V
Supply Voltage-Nom
1 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
19 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Qualification Status
Not Qualified
Compare MPC8306SVMABCA with alternatives
Compare MPC8280CVRQLDX with alternatives