MPC8306CVMADDCA
vs
MPC8306CVMADFCA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369
LFBGA,
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
Address Bus Width
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.67 MHz
66.67 MHz
External Data Bus Width
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B369
S-PBGA-B369
JESD-609 Code
e2
e1
Length
19 mm
19 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
369
369
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.61 mm
1.61 mm
Speed
266 MHz
266 MHz
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Silver (Sn/Ag)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
19 mm
19 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
369
Compare MPC8306CVMADDCA with alternatives
Compare MPC8306CVMADFCA with alternatives