MPC8280CVRQLDX vs MPC8270VRMIBA feature comparison

MPC8280CVRQLDX NXP Semiconductors

Buy Now Datasheet

MPC8270VRMIBA NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Active Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-516 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FBGA-516
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 266 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
Length 27 mm 27 mm
Low Power Mode NO NO
Number of Terminals 516 516
Operating Temperature-Max 105 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 333 MHz 66.67 MHz
Supply Voltage-Max 1.6 V 1.6 V
Supply Voltage-Min 1.45 V 1.45 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Rohs Code Yes
Factory Lead Time 52 Weeks
Samacsys Manufacturer NXP
JESD-609 Code e2
Moisture Sensitivity Level 3
Package Equivalence Code BGA516,26X26,40
Peak Reflow Temperature (Cel) 245
Terminal Finish Tin/Silver (Sn/Ag)
Time@Peak Reflow Temperature-Max (s) 30

Compare MPC8280CVRQLDX with alternatives

Compare MPC8270VRMIBA with alternatives