MPC8270VRMIBA
vs
MPC8270ZQMIBA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
ROCHESTER ELECTRONICS LLC
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FBGA-516
27 X 27 MM, 1 MM PITCH, PLASTIC, FBGA-516
Pin Count
516
516
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
266 MHz
266 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B516
S-PBGA-B516
JESD-609 Code
e2
e0
Length
27 mm
27 mm
Low Power Mode
NO
NO
Moisture Sensitivity Level
3
3
Number of Terminals
516
516
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA516,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
245
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
2.55 mm
2.55 mm
Speed
66.67 MHz
66.67 MHz
Supply Voltage-Max
1.6 V
1.6 V
Supply Voltage-Min
1.45 V
1.45 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
3
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