MPC8275CZQMIBA
vs
MPC8313CZQADDC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
Package Description
27 X 27 MM, 1 MM PITCH, PLASTIC, FBGA-516
TEBGAII-516
Pin Count
516
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
15
Bit Size
32
Boundary Scan
YES
YES
Clock Frequency-Max
266 MHz
External Data Bus Width
64
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B516
S-PBGA-B516
JESD-609 Code
e0
e0
Length
27 mm
27 mm
Low Power Mode
NO
YES
Moisture Sensitivity Level
3
3
Number of Terminals
516
516
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
HBGA
Package Equivalence Code
BGA516,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel)
245
260
Qualification Status
Not Qualified
Seated Height-Max
2.55 mm
2.55 mm
Speed
66.67 MHz
266 MHz
Supply Voltage-Max
1.6 V
1.05 V
Supply Voltage-Min
1.45 V
0.95 V
Supply Voltage-Nom
1.5 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
40
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
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