Part Details for MPC8313CZQADDC by Freescale Semiconductor
Overview of MPC8313CZQADDC by Freescale Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MPC8313CZQADDC
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-MPC8313CZQADDC-ND
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DigiKey | IC MPU MPC83XX 267MHZ 516TEPBGA Min Qty: 11 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
320 In Stock |
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$27.6200 | Buy Now |
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Rochester Electronics | PowerQUICC 32 Bit Power Architecture SoC, 266MHz, DDR1/2, PCI, GbE, USB, -40 to 105C, Rev 3 RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 320 |
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$22.5800 / $26.5600 | Buy Now |
Part Details for MPC8313CZQADDC
MPC8313CZQADDC CAD Models
MPC8313CZQADDC Part Data Attributes
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MPC8313CZQADDC
Freescale Semiconductor
Buy Now
Datasheet
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Compare Parts:
MPC8313CZQADDC
Freescale Semiconductor
PowerQUICC, 32 Bit Power Architecture SoC, 266MHz, DDR1/2, PCI, GbE, USB, -40 to 105C, Rev 3
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Package Description | TEBGAII-516 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 15 | |
| Boundary Scan | YES | |
| External Data Bus Width | 32 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B516 | |
| JESD-609 Code | e0 | |
| Length | 27 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 516 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 2.55 mm | |
| Speed | 266 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead/Silver (Sn/Pb/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 27 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |