MPC8260ACVVIFBX
vs
PCX8265AMTPUMHBC
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TELEDYNE E2V (UK) LTD
|
Package Description |
LBGA,
|
LBGA,
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
480
|
Additional Feature |
|
ALSO REQUIRES 3.3V SUPPLY
|
Address Bus Width |
|
32
|
Bit Size |
|
32
|
Boundary Scan |
|
YES
|
Clock Frequency-Max |
|
66.66 MHz
|
External Data Bus Width |
|
64
|
Format |
|
FLOATING POINT
|
Integrated Cache |
|
YES
|
JESD-30 Code |
|
S-PBGA-B480
|
Length |
|
37.5 mm
|
Low Power Mode |
|
NO
|
Number of Terminals |
|
480
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LBGA
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.65 mm
|
Speed |
|
200 MHz
|
Supply Voltage-Max |
|
1.9 V
|
Supply Voltage-Min |
|
1.7 V
|
Supply Voltage-Nom |
|
1.8 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
MILITARY
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
37.5 mm
|
uPs/uCs/Peripheral ICs Type |
|
MICROPROCESSOR, RISC
|
|
|
|
Compare MPC8260ACVVIFBX with alternatives
Compare PCX8265AMTPUMHBC with alternatives