MPC8255AVVMHBB
vs
MPC8265ACZUMHBC
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
37.50 X 37.50 MM, 1.55 MM HEIGHT, , 1.27 MM PITCH, LEAD FREE, TBGA-480
|
37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480
|
Pin Count |
480
|
480
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
|
Samacsys Manufacturer |
NXP
|
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
66.66 MHz
|
66.66 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B480
|
S-PBGA-B480
|
JESD-609 Code |
e1
|
e0
|
Length |
37.5 mm
|
37.5 mm
|
Low Power Mode |
NO
|
NO
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
480
|
480
|
Operating Temperature-Max |
105 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
220
|
Seated Height-Max |
1.65 mm
|
1.65 mm
|
Speed |
266 MHz
|
266 MHz
|
Supply Voltage-Max |
2.2 V
|
2.2 V
|
Supply Voltage-Min |
1.9 V
|
1.9 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
37.5 mm
|
37.5 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
5
|
Qualification Status |
|
COMMERCIAL
|
Supply Voltage-Nom |
|
2 V
|
|
|
|
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