MPC8250AVVPIBC
vs
MPC8272ZQMIBA
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-480
|
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Address Bus Width |
32
|
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| External Data Bus Width |
64
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B480
|
|
| JESD-609 Code |
e1
|
e0
|
| Length |
37.5 mm
|
|
| Low Power Mode |
NO
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
480
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LBGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
245
|
| Seated Height-Max |
1.65 mm
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Lead/Silver (Sn/Pb/Ag)
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
37.5 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare MPC8250AVVPIBC with alternatives