MPC8245TZU266D
vs
GX1-200B-85-1.8
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
LBGA, BGA352,26X26,50
|
BGA-352
|
| Pin Count |
352
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
|
| Additional Feature |
ALSO OPERATES AT 2V SUPPLY
|
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
66 MHz
|
33 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
| Length |
35 mm
|
35 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
352
|
352
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
BGA
|
| Package Equivalence Code |
BGA352,26X26,50
|
BGA352,26X26,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
220
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.65 mm
|
2.23 mm
|
| Speed |
266 MHz
|
200 MHz
|
| Supply Voltage-Max |
1.9 V
|
1.89 V
|
| Supply Voltage-Min |
1.7 V
|
1.71 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
35 mm
|
35 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
5
|
4
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Temperature Grade |
|
OTHER
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
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