MPC8245TZU266D
vs
MCF5485CZP200
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Not Recommended
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352
27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.2
5A002.A.1
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
NXP
Additional Feature
ALSO OPERATES AT 2V SUPPLY
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
66.67 MHz
External Data Bus Width
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B352
S-PBGA-B388
JESD-609 Code
e0
e0
Length
35 mm
27 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
352
388
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Peak Reflow Temperature (Cel)
220
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.65 mm
2.55 mm
Speed
266 MHz
200 MHz
Supply Voltage-Max
1.9 V
3.6 V
Supply Voltage-Min
1.7 V
3 V
Supply Voltage-Nom
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
40
Width
35 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Factory Lead Time
13 Weeks
Compare MPC8245TZU266D with alternatives
Compare MCF5485CZP200 with alternatives