MPC8245TZU266D vs XPC8245LZU266LA feature comparison

MPC8245TZU266D Rochester Electronics LLC

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XPC8245LZU266LA Motorola Semiconductor Products

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Pbfree Code Yes
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC MOTOROLA INC
Part Package Code BGA
Package Description 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352 LBGA, BGA352,26X26,50
Pin Count 352
Reach Compliance Code unknown unknown
Additional Feature ALSO OPERATES AT 2V SUPPLY ALSO OPERATES WITH 2V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e0
Length 35 mm 35 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 352 352
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 220
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 1.65 mm 1.65 mm
Speed 266 MHz 266 MHz
Supply Voltage-Max 1.9 V 1.9 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 5 3
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Package Equivalence Code BGA352,26X26,50

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