MPC8240LZU266X vs XPC8240RZU250E feature comparison

MPC8240LZU266X Motorola Semiconductor Products

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XPC8240RZU250E Freescale Semiconductor

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Package Description LBGA, LBGA, BGA352,26X26,50
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature IT ALSO REQUIRES 3.0 TO 3.6 V FOR I/O ALSO REQUIRES 3.3V I/O SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 266 MHz 66 MHz
External Data Bus Width 64 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B352 S-PBGA-B352
Length 35 mm 35 mm
Low Power Mode YES YES
Number of Terminals 352 352
Operating Temperature-Max 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.65 mm 1.65 mm
Speed 266 MHz 250 MHz
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 5
Pbfree Code No
Rohs Code No
Part Package Code BGA
Pin Count 352
JESD-609 Code e0
Moisture Sensitivity Level 3
Package Equivalence Code BGA352,26X26,50
Peak Reflow Temperature (Cel) 220
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)
Time@Peak Reflow Temperature-Max (s) 30

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