XPC8240RZU250E
vs
MPC8240RZU250X
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
LBGA, BGA352,26X26,50
|
LBGA,
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
ALSO REQUIRES 3.3V I/O SUPPLY
|
|
Address Bus Width |
32
|
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
66 MHz
|
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
Length |
35 mm
|
35 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
352
|
352
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA352,26X26,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.65 mm
|
1.65 mm
|
Speed |
250 MHz
|
250 MHz
|
Supply Voltage-Max |
2.625 V
|
2.625 V
|
Supply Voltage-Min |
2.375 V
|
2.375 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
35 mm
|
35 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
5
|
4
|
Operating Temperature-Max |
|
105 °C
|
Operating Temperature-Min |
|
|
Temperature Grade |
|
OTHER
|
|
|
|