MPC7410HX500LE
vs
MPC7410RX500LC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
BGA
Package Description
25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360
25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
Pin Count
360
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.1
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
133 MHz
133 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B360
S-CBGA-B360
JESD-609 Code
e0
Length
25 mm
25 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
Number of Terminals
360
360
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
HBGA
BGA
Package Equivalence Code
BGA360,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.2 mm
3.2 mm
Speed
500 MHz
500 MHz
Supply Voltage-Max
1.9 V
1.9 V
Supply Voltage-Min
1.7 V
1.7 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
5
3
Compare MPC7410HX500LE with alternatives
Compare MPC7410RX500LC with alternatives