Findchips: Compare MPC7410RX400LD vs MPC7410RX400LC

MPC7410RX400LD vs MPC7410RX400LC feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	MOTOROLA INC	FREESCALE SEMICONDUCTOR INC
Part Package Code	BGA	BGA
Package Description	BGA,	25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
Pin Count	360	360
Reach Compliance Code	unknown	unknown
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
Address Bus Width	32	32
Bit Size	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	133 MHz	133 MHz
External Data Bus Width	64	64
Format	FLOATING POINT	FLOATING POINT
Integrated Cache	YES	YES
JESD-30 Code	S-CBGA-B360	S-CBGA-B360
Length	25 mm	25 mm
Low Power Mode	YES	YES
Number of Terminals	360	360
Package Body Material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package Code	BGA	HBGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY, HEAT SINK/SLUG
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.2 mm	3.2 mm
Speed	400 MHz	400 MHz
Supply Voltage-Max	1.9 V	1.9 V
Supply Voltage-Min	1.7 V	1.7 V
Supply Voltage-Nom	1.8 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	25 mm	25 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	3	3
Package Equivalence Code		BGA360,19X19,50
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors