MPC604ERX333
vs
XPC823ZT25
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
Package Description |
BGA, BGA255,16X16,50
|
BGA,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
26
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
333 MHz
|
25 MHz
|
External Data Bus Width |
64
|
32
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
NO
|
YES
|
JESD-30 Code |
S-CBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e0
|
|
Length |
21 mm
|
23 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA255,16X16,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.3 mm
|
2.35 mm
|
Speed |
333 MHz
|
|
Supply Voltage-Max |
2 V
|
3.6 V
|
Supply Voltage-Min |
1.8 V
|
3 V
|
Supply Voltage-Nom |
1.9 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
21 mm
|
23 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
256
|
|
|
|
Compare MPC604ERX333 with alternatives
Compare XPC823ZT25 with alternatives