XPC823ZT25
vs
MPC852TVR50A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
PLASTIC, BGA-256
Pin Count
256
256
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
26
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
25 MHz
66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
23 mm
23 mm
Low Power Mode
YES
YES
Number of Terminals
256
256
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.35 mm
2.54 mm
Supply Voltage-Max
3.6 V
1.9 V
Supply Voltage-Min
3 V
1.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Pbfree Code
Rohs Code
ECCN Code
3A991.A.2
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
JESD-609 Code
e1
Moisture Sensitivity Level
3
Package Equivalence Code
BGA256,16X16,50
Peak Reflow Temperature (Cel)
245
Speed
50 MHz
Supply Voltage-Nom
1.8 V
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
30
Compare XPC823ZT25 with alternatives
Compare MPC852TVR50A with alternatives