MPC565MZP40
vs
KMPC555LFMZP40
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA388,22X22,40
|
BGA,
|
| Pin Count |
388
|
272
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
|
| Additional Feature |
ALSO REQUIRES 5V SUPPLY
|
ALSO REQUIRES 5V SUPPLY
|
| Address Bus Width |
24
|
|
| Bit Size |
32
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
32
|
|
| JESD-30 Code |
S-PBGA-B388
|
S-PBGA-B272
|
| Number of Terminals |
388
|
272
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA388,22X22,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
36864
|
|
| ROM (words) |
1048576
|
|
| ROM Programmability |
FLASH
|
|
| Speed |
40 MHz
|
|
| Supply Current-Max |
120 mA
|
|
| Supply Voltage-Max |
2.7 V
|
3.6 V
|
| Supply Voltage-Min |
2.5 V
|
3 V
|
| Supply Voltage-Nom |
2.6 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
2
|
1
|
| Length |
|
27 mm
|
| Seated Height-Max |
|
2.65 mm
|
| Width |
|
27 mm
|
|
|
|
Compare MPC565MZP40 with alternatives
Compare KMPC555LFMZP40 with alternatives