MPC563CZP40
vs
MPC564MZP56R2
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
| Package Description |
27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
|
BGA, BGA388,26X26,40
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
24
|
24
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PBGA-B388
|
S-PBGA-B388
|
| Length |
27 mm
|
27 mm
|
| Number of I/O Lines |
16
|
16
|
| Number of Terminals |
388
|
388
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA388,26X26,40
|
BGA388,26X26,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
32768
|
32768
|
| ROM (words) |
524288
|
524288
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
2.55 mm
|
2.55 mm
|
| Speed |
40 MHz
|
56 MHz
|
| Supply Voltage-Max |
2.7 V
|
2.7 V
|
| Supply Voltage-Min |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom |
2.6 V
|
2.6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
5
|
3
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
388
|
|
|
|
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