MPC563CZP40
vs
MPC563CZP40
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
12 Weeks
Samacsys Manufacturer
NXP
Has ADC
NO
NO
Address Bus Width
24
24
Bit Size
32
32
Boundary Scan
NO
Clock Frequency-Max
20 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
32
32
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
JESD-609 Code
e0
e0
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
16
16
Number of Terminals
388
388
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA388,26X26,40
BGA388,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
240
240
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
32768
32768
ROM (words)
524288
524288
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.55 mm
2.55 mm
Speed
40 MHz
40 MHz
Supply Voltage-Max
2.7 V
2.7 V
Supply Voltage-Min
2.6 V
2.5 V
Supply Voltage-Nom
2.6 V
2.6 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
Tin/Lead/Silver (Sn62Pb36Ag2)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
2
Pbfree Code
Part Package Code
BGA
Pin Count
388
Compare MPC563CZP40 with alternatives
Compare MPC563CZP40 with alternatives