MPC561MZP56R2
vs
MPC555LFAZP40
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
MOTOROLA INC
Part Package Code
BGA
BGA
Package Description
BGA, BGA388,26X26,40
BGA,
Pin Count
388
272
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
YES
Address Bus Width
24
24
Bit Size
32
32
Clock Frequency-Max
20 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
32
32
JESD-30 Code
S-PBGA-B388
S-PBGA-B272
Length
27 mm
27 mm
Number of I/O Lines
16
101
Number of Terminals
388
272
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
PWM Channels
NO
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA388,26X26,40
BGA272,20X20,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
32768
26624
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.55 mm
2.65 mm
Speed
56 MHz
40 MHz
Supply Voltage-Max
2.7 V
3.6 V
Supply Voltage-Min
2.5 V
3 V
Supply Voltage-Nom
2.6 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
HCMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
4
6
ECCN Code
3A001.A.2.C
Additional Feature
ALSO REQUIRES 5V SUPPLY
Boundary Scan
YES
CPU Family
MPC500
Format
FLOATING POINT
Low Power Mode
YES
Number of DMA Channels
Number of Serial I/Os
4
Number of Timers
3
On Chip Data RAM Width
8
On Chip Program ROM Width
8
ROM (words)
458752
Compare MPC561MZP56R2 with alternatives
Compare MPC555LFAZP40 with alternatives