MPC555LFAZP40
vs
MPC565CVR40R2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-388
Pin Count
272
388
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A991
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
NO
Additional Feature
ALSO REQUIRES 5V SUPPLY
ALSO REQUIRES 5V SUPPLY
Address Bus Width
24
24
Bit Size
32
32
Boundary Scan
YES
CPU Family
MPC500
Clock Frequency-Max
20 MHz
84 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
32
32
Format
FLOATING POINT
JESD-30 Code
S-PBGA-B272
S-PBGA-B388
Length
27 mm
27 mm
Low Power Mode
YES
Number of DMA Channels
Number of I/O Lines
101
Number of Serial I/Os
4
Number of Terminals
272
388
Number of Timers
3
On Chip Data RAM Width
8
On Chip Program ROM Width
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA272,20X20,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
26624
ROM (words)
458752
1048576
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.65 mm
2.55 mm
Speed
40 MHz
40 MHz
Supply Voltage-Max
3.6 V
2.7 V
Supply Voltage-Min
3 V
2.6 V
Supply Voltage-Nom
3.3 V
2.6 V
Surface Mount
YES
YES
Technology
HCMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
6
1
Rohs Code
JESD-609 Code
e1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
40
Compare MPC555LFAZP40 with alternatives
Compare MPC565CVR40R2 with alternatives