MPC561MZP56R2
vs
MPC564MZP56
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA, BGA388,26X26,40
27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
Pin Count
388
388
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
24
24
Bit Size
32
32
Clock Frequency-Max
20 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
32
32
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
Length
27 mm
27 mm
Number of I/O Lines
16
16
Number of Terminals
388
388
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA388,26X26,40
BGA388,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
32768
32768
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.55 mm
2.55 mm
Speed
56 MHz
56 MHz
Supply Voltage-Max
2.7 V
2.7 V
Supply Voltage-Min
2.5 V
2.5 V
Supply Voltage-Nom
2.6 V
2.6 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
2
Pbfree Code
Rohs Code
ECCN Code
3A991.A.2
JESD-609 Code
e0
Moisture Sensitivity Level
3
On Chip Program ROM Width
8
Peak Reflow Temperature (Cel)
240
ROM (words)
524288
Terminal Finish
Tin/Lead/Silver (Sn62Pb36Ag2)
Time@Peak Reflow Temperature-Max (s)
30
Compare MPC561MZP56R2 with alternatives
Compare MPC564MZP56 with alternatives