MPC556 vs MPC564MZP56 feature comparison

MPC556 Motorola Semiconductor Products

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MPC564MZP56 Freescale Semiconductor

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Package Description BGA, 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width 24 24
Bit Size 32 32
Clock Frequency-Max 40 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B272 S-PBGA-B388
Number of Terminals 272 388
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Speed 40 MHz 56 MHz
Supply Voltage-Max 3.6 V 2.7 V
Supply Voltage-Min 3 V 2.5 V
Supply Voltage-Nom 3.3 V 2.6 V
Surface Mount YES YES
Technology HCMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Part Package Code BGA
Pin Count 388
Samacsys Manufacturer NXP
JESD-609 Code e0
Length 27 mm
Moisture Sensitivity Level 3
Number of I/O Lines 16
On Chip Program ROM Width 8
Package Equivalence Code BGA388,26X26,40
Peak Reflow Temperature (Cel) 240
RAM (bytes) 32768
ROM (words) 524288
Seated Height-Max 2.55 mm
Terminal Finish Tin/Lead/Silver (Sn62Pb36Ag2)
Terminal Pitch 1 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm

Compare MPC556 with alternatives

Compare MPC564MZP56 with alternatives