MPC564MZP56
vs
MPC562MZP56R2
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
Package Description |
27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
|
27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Address Bus Width |
24
|
24
|
Bit Size |
32
|
32
|
Clock Frequency-Max |
20 MHz
|
20 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
32
|
32
|
JESD-30 Code |
S-PBGA-B388
|
S-PBGA-B388
|
Length |
27 mm
|
27 mm
|
Number of I/O Lines |
16
|
16
|
Number of Terminals |
388
|
388
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA388,26X26,40
|
BGA388,26X26,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
32768
|
32768
|
ROM (words) |
524288
|
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
2.55 mm
|
2.55 mm
|
Speed |
56 MHz
|
56 MHz
|
Supply Voltage-Max |
2.7 V
|
2.7 V
|
Supply Voltage-Min |
2.5 V
|
2.5 V
|
Supply Voltage-Nom |
2.6 V
|
2.6 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
4
|
3
|
|
|
|