MPC565CVR40R2
vs
MPC565MZP40
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
BGA
Package Description
27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-388
BGA, BGA388,22X22,40
Pin Count
388
Reach Compliance Code
compliant
unknown
ECCN Code
3A991
HTS Code
8542.31.00.01
Has ADC
NO
Additional Feature
ALSO REQUIRES 5V SUPPLY
Address Bus Width
24
Bit Size
32
32
Clock Frequency-Max
84 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
32
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
JESD-609 Code
e1
Length
27 mm
Moisture Sensitivity Level
3
Number of I/O Lines
Number of Terminals
388
388
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
ROM (words)
1048576
1048576
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.55 mm
Speed
40 MHz
40 MHz
Supply Voltage-Max
2.7 V
Supply Voltage-Min
2.6 V
Supply Voltage-Nom
2.6 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
27 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Base Number Matches
1
3
Package Equivalence Code
BGA388,22X22,40
Power Supplies
2.6,5 V
RAM (bytes)
36864
Supply Current-Max
120 mA
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