MPC180LMB
vs
SB80C188EC13
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
INTEL CORP
Part Package Code
QFP
QFP
Package Description
LFQFP,
SHRINK, QFP-100
Pin Count
100
100
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
20
Boundary Scan
YES
NO
Clock Frequency-Max
66 MHz
26 MHz
External Data Bus Width
32
8
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
Length
14 mm
14 mm
Low Power Mode
NO
YES
Number of Terminals
100
100
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.66 mm
Supply Voltage-Max
1.95 V
5.5 V
Supply Voltage-Min
1.65 V
4.5 V
Supply Voltage-Nom
1.8 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
3
Rohs Code
Samacsys Manufacturer
Intel
Bit Size
16
JESD-609 Code
e0
Package Equivalence Code
QFP100,.63SQ,20
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
5 V
Speed
13 MHz
Supply Current-Max
70 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MPC180LMB with alternatives
Compare SB80C188EC13 with alternatives