MPA1765PC vs 5962-9471701MPA feature comparison

MPA1765PC Motorola Mobility LLC

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5962-9471701MPA AMD Xilinx

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC XILINX INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.71 8542.32.00.51
JESD-30 Code R-PDIP-T8 R-GDIP-T8
Length 9.78 mm 10.16 mm
Memory Density 65536 bit 65536 bit
Memory IC Type OTP ROM CONFIGURATION MEMORY
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 64KX1 64KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Clock Frequency-Max (fCLK) 5 MHz
I/O Type COMMON
JESD-609 Code e0
Package Equivalence Code DIP8,.3
Screening Level MIL-STD-883
Standby Current-Max 0.0015 A
Supply Current-Max 0.01 mA
Terminal Finish TIN LEAD

Compare MPA1765PC with alternatives

Compare 5962-9471701MPA with alternatives