MPA1765PC
vs
EPC1064PM
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
ALTERA CORP
Package Description
DIP,
DIP,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.71
8542.32.00.51
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
Length
9.78 mm
9.398 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
OTP ROM
CONFIGURATION MEMORY
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
64KX1
64KX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
4.318 mm
Supply Voltage-Max (Vsup)
6 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Part Package Code
DIP
Pin Count
8
Additional Feature
4 WIRE INTERFACE TO FLEX 8000 DEVICES
Compare MPA1765PC with alternatives
Compare EPC1064PM with alternatives