MPA17128PI
vs
XC17128DPD8C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
XILINX INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.51
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
Length
9.78 mm
9.3599 mm
Memory Density
131072 bit
131072 bit
Memory IC Type
OTP ROM
CONFIGURATION MEMORY
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128KX1
128KX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
4.5974 mm
Supply Voltage-Max (Vsup)
6 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Rohs Code
Clock Frequency-Max (fCLK)
12.5 MHz
I/O Type
COMMON
JESD-609 Code
e0
Moisture Sensitivity Level
1
Package Equivalence Code
DIP8,.3
Peak Reflow Temperature (Cel)
225
Standby Current-Max
0.00005 A
Supply Current-Max
0.01 mA
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
30
Compare MPA17128PI with alternatives
Compare XC17128DPD8C with alternatives