XC17128DPD8C
vs
MCP17128IN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
MOTOROLA INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP8,.3
DIP,
Pin Count
8
8
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.71
Clock Frequency-Max (fCLK)
12.5 MHz
I/O Type
COMMON
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e0
Length
9.3599 mm
9.78 mm
Memory Density
131072 bit
131072 bit
Memory IC Type
CONFIGURATION MEMORY
OTP ROM
Memory Width
1
1
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX1
128KX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.5974 mm
4.45 mm
Standby Current-Max
0.00005 A
Supply Current-Max
0.01 mA
Supply Voltage-Max (Vsup)
5.25 V
6 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
7.62 mm
7.62 mm
Base Number Matches
1
2
Compare XC17128DPD8C with alternatives
Compare MCP17128IN with alternatives