MNR04MRAPJ301
vs
TSN2BJ301V
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
TATEYAMA KAGAKU GROUP
|
| Reach Compliance Code |
compliant
|
unknown
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e3
|
|
| Network Type |
ISOLATED
|
ISOLATED
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
155 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.4 mm
|
0.35 mm
|
| Package Length |
2 mm
|
1 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1 mm
|
2 mm
|
| Packing Method |
TR, Paper, 7 Inch
|
TAPE
|
| Rated Power Dissipation (P) |
0.063 W
|
0.063 W
|
| Resistance |
300 Ω
|
300 Ω
|
| Resistor Type |
ARRAY/NETWORK RESISTOR
|
ARRAY/NETWORK RESISTOR
|
| Size Code |
0804
|
0408
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
|
| Tolerance |
5%
|
5%
|
| Working Voltage |
25 V
|
25 V
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8533.21.00.20
|
| First Element Resistance |
|
300 Ω
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Number of Elements |
|
1
|
| Number of Functions |
|
4
|
| Rated Temperature |
|
70 °C
|
| Second/Last Element Resistance |
|
300 Ω
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare MNR04MRAPJ301 with alternatives
Compare TSN2BJ301V with alternatives