MN103E010H vs IBM25PPC750GXEBB5083T feature comparison

MN103E010H Panasonic Electronic Components

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IBM25PPC750GXEBB5083T IBM

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer PANASONIC CORP IBM MICROELECTRONICS
Part Package Code BGA BGA
Package Description BGA, 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
Pin Count 292 292
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Bit Size 32 32
Clock Frequency-Max 133 MHz 200 MHz
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code X-PBGA-B292 S-CBGA-B292
Number of Terminals 292 292
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape UNSPECIFIED SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Speed 133 MHz 933 MHz
Supply Voltage-Max 1.89 V 1.55 V
Supply Voltage-Min 1.71 V 1.45 V
Supply Voltage-Nom 1.8 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 2 1
Rohs Code No
Address Bus Width 32
Boundary Scan YES
External Data Bus Width 64
Length 21 mm
Low Power Mode YES
Package Equivalence Code BGA292,20X20,40
Seated Height-Max 3.137 mm
Terminal Pitch 1 mm
Width 21 mm

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