MMBZ5227BL vs MSP1N5227BTR feature comparison

MMBZ5227BL Motorola Semiconductor Products

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MSP1N5227BTR Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MICROSEMI CORP
Package Description CASE 318-07, 3 PIN HERMETIC SEALED, GLASS, DO-7, 2 PIN
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 24 Ω
JEDEC-95 Code TO-236AB DO-204AA
JESD-30 Code R-PDSO-G3 O-LALF-W2
JESD-609 Code e0 e0
Knee Impedance-Max 1700 Ω
Number of Elements 1 1
Number of Terminals 3 2
Operating Temperature-Max 150 °C 175 °C
Operating Temperature-Min -55 °C -65 °C
Package Body Material PLASTIC/EPOXY GLASS
Package Shape RECTANGULAR ROUND
Package Style SMALL OUTLINE LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.225 W 0.417 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3.6 V 3.6 V
Reverse Current-Max 15 µA
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING WIRE
Terminal Position DUAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 20 mA 20 mA
Base Number Matches 4 2
Part Package Code DO-7
Pin Count 2
Case Connection ISOLATED
Moisture Sensitivity Level 1

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Compare MSP1N5227BTR with alternatives