MMBD353LT1
vs
PMBD353,215
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ON SEMICONDUCTOR
NXP SEMICONDUCTORS
Part Package Code
SOT-23 (TO-236) 3 LEAD
TO-236
Package Description
CASE 318-08, TO-236, 3 PIN
PLASTIC, SST3, 3 PIN
Pin Count
3
3
Manufacturer Package Code
318
SOT23
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.60
8541.10.00.70
Samacsys Manufacturer
onsemi
Configuration
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Diode Capacitance-Max
1 pF
1 pF
Diode Element Material
SILICON
SILICON
Diode Type
MIXER DIODE
MIXER DIODE
Frequency Band
ULTRA HIGH FREQUENCY
ULTRA HIGH FREQUENCY
JEDEC-95 Code
TO-236AB
TO-236AB
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e0
e3
Moisture Sensitivity Level
1
1
Number of Elements
2
2
Number of Terminals
3
3
Operating Temperature-Max
125 °C
100 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
235
260
Power Dissipation-Max
0.225 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
Tin/Lead (Sn/Pb)
TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
3
1
Rohs Code
Forward Voltage-Max (VF)
0.6 V
Output Current-Max
0.03 A
Rep Pk Reverse Voltage-Max
4 V
Technology
SCHOTTKY
Compare MMBD353LT1 with alternatives
Compare PMBD353,215 with alternatives