PMBD353,215 vs MMBD353LT1G feature comparison

PMBD353,215 NXP Semiconductors

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MMBD353LT1G Rochester Electronics LLC

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Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code TO-236 SOT-23
Package Description PLASTIC, SST3, 3 PIN HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, 3 PIN
Pin Count 3 3
Manufacturer Package Code SOT23 CASE 318-08
Reach Compliance Code compliant unknown
HTS Code 8541.10.00.70
Configuration SERIES CONNECTED, CENTER TAP, 2 ELEMENTS SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Diode Capacitance-Max 1 pF 1 pF
Diode Element Material SILICON SILICON
Diode Type MIXER DIODE MIXER DIODE
Forward Voltage-Max (VF) 0.6 V
Frequency Band ULTRA HIGH FREQUENCY ULTRA HIGH FREQUENCY
JEDEC-95 Code TO-236AB TO-236AB
JESD-30 Code R-PDSO-G3 R-PDSO-G3
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 NOT SPECIFIED
Number of Elements 2 2
Number of Terminals 3 3
Operating Temperature-Max 100 °C
Output Current-Max 0.03 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified COMMERCIAL
Rep Pk Reverse Voltage-Max 4 V
Surface Mount YES YES
Technology SCHOTTKY
Terminal Finish TIN MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 40
Base Number Matches 2 2
Pbfree Code No
Power Dissipation-Max 0.225 W

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