MMBD301LT1G
vs
BAT17,235
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ONSEMI
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOT-23 (TO-236) 3 LEAD
|
TO-236
|
| Package Description |
HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE 318-08, 3 PIN
|
|
| Pin Count |
3
|
3
|
| Manufacturer Package Code |
318-08
|
SOT23
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.60
|
8541.10.00.70
|
| Factory Lead Time |
50 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance-Max |
1.5 pF
|
1 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
MIXER DIODE
|
MIXER DIODE
|
| Frequency Band |
ULTRA HIGH FREQUENCY
|
ULTRA HIGH FREQUENCY
|
| JEDEC-95 Code |
TO-236
|
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
125 °C
|
100 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Dissipation-Max |
0.2 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Finish |
MATTE TIN
|
TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Breakdown Voltage-Min |
|
4 V
|
| Forward Voltage-Max (VF) |
|
0.6 V
|
| Noise Figure-Max |
|
8 dB
|
| Output Current-Max |
|
30 A
|
| Reverse Current-Max |
|
0.25 µA
|
|
|
|
Compare MMBD301LT1G with alternatives
Compare BAT17,235 with alternatives