BAT17,235
vs
SMMBD301LT3
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ON SEMICONDUCTOR
|
Part Package Code |
TO-236
|
SOT-23
|
Pin Count |
3
|
3
|
Manufacturer Package Code |
SOT23
|
CASE 318-08
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8541.10.00.70
|
8541.10.00.60
|
Factory Lead Time |
4 Weeks
|
|
Breakdown Voltage-Min |
4 V
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Capacitance-Max |
1 pF
|
1.5 pF
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
MIXER DIODE
|
MIXER DIODE
|
Forward Voltage-Max (VF) |
0.6 V
|
|
Frequency Band |
ULTRA HIGH FREQUENCY
|
VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
JESD-609 Code |
e3
|
e0
|
Moisture Sensitivity Level |
1
|
|
Noise Figure-Max |
8 dB
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
100 °C
|
|
Output Current-Max |
30 A
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reverse Current-Max |
0.25 µA
|
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Finish |
TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
2
|
1
|
Package Description |
|
PLASTIC, CASE 318-08, TO-236, 3 PIN
|
ECCN Code |
|
EAR99
|
JEDEC-95 Code |
|
TO-236AB
|
Power Dissipation-Max |
|
0.2 W
|
|
|
|
Compare BAT17,235 with alternatives
Compare SMMBD301LT3 with alternatives