MMA7361LCR2
vs
MMA6260Q
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
MOTOROLA INC
|
| Part Package Code |
LGA
|
QFN
|
| Package Description |
TFBGA, LGA14,3X6,32
|
QCCN, LCC16,.23SQ,40
|
| Pin Count |
14
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
| JESD-30 Code |
R-PBGA-B14
|
S-XQCC-N16
|
| Length |
5 mm
|
6 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TFBGA
|
QCCN
|
| Package Equivalence Code |
LGA14,3X6,32
|
LCC16,.23SQ,40
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.05 mm
|
2.08 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.2 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Form |
BUTT
|
NO LEAD
|
| Terminal Pitch |
0.8 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3 mm
|
6 mm
|
| Base Number Matches |
2
|
4
|
|
|
|
Compare MMA7361LCR2 with alternatives
Compare MMA6260Q with alternatives