MM908E624ACDWB/R2
vs
PM908E624ACDWB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
SOIC
SOIC
Package Description
SSOP,
SSOP,
Pin Count
54
54
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDSO-G54
R-PDSO-G54
JESD-609 Code
e0
Length
17.9 mm
17.9 mm
Moisture Sensitivity Level
3
Number of I/O Lines
17
17
Number of Terminals
54
54
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.65 mm
2.65 mm
Speed
8 MHz
8 MHz
Supply Voltage-Max
18 V
18 V
Supply Voltage-Min
5.5 V
5.5 V
Supply Voltage-Nom
13.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
7.5 mm
7.5 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
3
Compare MM908E624ACDWB/R2 with alternatives
Compare PM908E624ACDWB with alternatives