MM74HCT533WMX
vs
TC74HCT540AFW-ELP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP, SOP20,.4
Pin Count
20
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
Length
12.8 mm
12.8 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
44 ns
23 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
2.7 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.5 mm
7.5 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Additional Feature
WITH DUAL OUTPUT ENABLE
Control Type
ENABLE LOW
Max I(ol)
0.006 A
Package Equivalence Code
SOP20,.4
Packing Method
TR
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Prop. Delay@Nom-Sup
25 ns
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MM74HCT533WMX with alternatives
Compare TC74HCT540AFW-ELP with alternatives