MM74HCT373N
vs
74HCT373BQ,115
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
DIP
QFN
Package Description
0.300 INCH, PLASTIC, MS-001, DIP-20
HVQCCN, LCC20,.1X.18,20
Pin Count
20
20
Manufacturer Package Code
20LD,MDIP,JEDEC MS-001, .300" WIDE
SOT764-1
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-PDIP-T20
R-PQCC-N20
JESD-609 Code
e3
e4
Length
26.075 mm
4.5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.006 A
0.006 A
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
HVQCCN
Package Equivalence Code
DIP20,.3
LCC20,.1X.18,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Prop. Delay@Nom-Sup
37 ns
45 ns
Propagation Delay (tpd)
56 ns
48 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
0.5 mm
Terminal Position
DUAL
QUAD
Width
7.62 mm
2.5 mm
Base Number Matches
2
1
Moisture Sensitivity Level
1
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare MM74HCT373N with alternatives
Compare 74HCT373BQ,115 with alternatives