74HCT373BQ,115
vs
DV74LS373P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
AVG SEMICONDUCTORS
Part Package Code
QFN
DIP
Package Description
HVQCCN, LCC20,.1X.18,20
DIP,
Pin Count
20
20
Manufacturer Package Code
SOT764-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
LS
JESD-30 Code
R-PQCC-N20
R-PDIP-T20
JESD-609 Code
e4
Length
4.5 mm
26.415 mm
Load Capacitance (CL)
50 pF
45 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.006 A
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-40 °C
-10 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
DIP
Package Equivalence Code
LCC20,.1X.18,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
IN-LINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
45 ns
Propagation Delay (tpd)
48 ns
28 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
4.57 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
TTL
Temperature Grade
AUTOMOTIVE
COMMERCIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
2.5 mm
7.62 mm
Base Number Matches
2
1
Power Supply Current-Max (ICC)
40 mA
Compare 74HCT373BQ,115 with alternatives
Compare DV74LS373P with alternatives