MM74HCT153J vs CD74HCT153E feature comparison

MM74HCT153J National Semiconductor Corporation

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CD74HCT153E Intersil Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP INTERSIL CORP
Package Description DIP, DIP16,.3 DIP-16
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT
JESD-30 Code R-GDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Length 19.43 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.004 A 0.004 A
Number of Functions 2 2
Number of Inputs 4 4
Number of Outputs 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 44 ns 51 ns
Propagation Delay (tpd) 50 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 3 7

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