MM74HCT139J
vs
TC74VHC238FS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TOSHIBA CORP
Package Description
DIP, DIP16,.3
LSSOP, SSOP16,.25
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
AHC/VHC
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-GDIP-T16
R-PDSO-G16
JESD-609 Code
e0
Length
19.43 mm
5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
2-LINE TO 4-LINE DECODER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.004 A
0.008 A
Number of Functions
2
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
LSSOP
Package Equivalence Code
DIP16,.3
SSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup
44 ns
11.5 ns
Propagation Delay (tpd)
44 ns
18 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
1.6 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
4.4 mm
Base Number Matches
2
2
Part Package Code
SOIC
Pin Count
16
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Compare TC74VHC238FS with alternatives