MM74HCT139J
vs
TC74HCT139AP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TOSHIBA CORP
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-GDIP-T16
R-PDIP-T16
JESD-609 Code
e0
Length
19.43 mm
19.25 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
2-LINE TO 4-LINE DECODER
2-LINE TO 4-LINE DECODER
Max I(ol)
0.004 A
0.004 A
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
44 ns
38 ns
Propagation Delay (tpd)
44 ns
38 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
4.45 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
3
1
Pbfree Code
Part Package Code
DIP
Pin Count
16
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MM74HCT139J with alternatives
Compare TC74HCT139AP with alternatives