MM74HC181WM
vs
TC74HC181P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TOSHIBA CORP
Part Package Code
SOIC
DIP
Package Description
SOP, SOP24,.4
DIP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD
CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; WITH INTERNAL CARRY LOOKAHEAD
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G24
R-PDIP-T24
JESD-609 Code
e0
e0
Length
15.34 mm
Load Capacitance (CL)
50 pF
Logic IC Type
ARITHMETIC LOGIC UNIT
ARITHMETIC LOGIC UNIT
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
24
24
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Propagation Delay (tpd)
63 ns
300 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.642 mm
5 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.5 mm
7.62 mm
Base Number Matches
3
1
Pbfree Code
Compare MM74HC181WM with alternatives
Compare TC74HC181P with alternatives