MM74HC11M
vs
TC74HC11AFN-ELP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP, SOP14,.25
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e0
e0
Length
8.65 mm
8.65 mm
Logic IC Type
AND GATE
AND GATE
Number of Functions
3
3
Number of Inputs
3
3
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
31 ns
21 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.9 mm
Base Number Matches
3
1
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Package Equivalence Code
SOP14,.25
Packing Method
TR
Prop. Delay@Nom-Sup
21 ns
Schmitt Trigger
NO
Compare MM74HC11M with alternatives
Compare TC74HC11AFN-ELP with alternatives