MM74HC08N
vs
5962-01-225-1558
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
HARRIS SEMICONDUCTOR
INTERSIL CORP
Package Description
,
DIP, DIP14,.3
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Logic IC Type
AND GATE
AND GATE
Qualification Status
Not Qualified
Not Qualified
Base Number Matches
7
2
Pbfree Code
Rohs Code
JESD-30 Code
R-XDIP-T14
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Number of Terminals
14
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC
Package Code
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Prop. Delay@Nom-Sup
27 ns
Schmitt Trigger
NO
Screening Level
38535Q/M;38534H;883B
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MM74HC08N with alternatives
Compare 5962-01-225-1558 with alternatives